Alloy 42,Low expansion 42 Alloy Sheet,UNS K94100,E FORU

British Specs:，American Specs: ASTM F30 ASTM B 753 AMS 5683 Welding Wire，German Specs: WS 1.3917,DIN 17745 AFNOR NF A54-301

**PRODUCT DATASHEET: ALLOY 42 / LOW EXPANSION 42 ALLOY SHEET** **UNS K94100 - Sheet Product Form** --- ### **1. OVERVIEW** **Alloy 42**, commercially known as **Low Expansion 42 Alloy**, is a precision **nickel-iron alloy** containing **42% nickel** that delivers an exceptionally **low coefficient of thermal expansion (CTE)**, specifically engineered to match **borosilicate glass, alumina ceramics, and semiconductor materials**. Supplied in **sheet form**, this product offers exceptional dimensional stability for applications requiring thin, flat material with minimal thermal expansion. The alloy is registered under the Unified Numbering System as **UNS K94100**. --- ### **2. CHEMICAL COMPOSITION (Weight %)** | Element | Alloy 42 Sheet Specification | UNS K94100 Requirements | |------------------|------------------------------|-------------------------| | **Nickel (Ni)** | 41.0 – 42.5% | 41.0 – 42.5% | | **Iron (Fe)** | Balance | Balance | | **Manganese (Mn)**| 0.50 – 0.80% | ≤ 0.80% | | **Silicon (Si)** | 0.15 – 0.30% | ≤ 0.30% | | **Carbon (C)** | ≤ 0.05% | ≤ 0.05% | | **Chromium (Cr)**| ≤ 0.15% | ≤ 0.15% | | **Copper (Cu)** | ≤ 0.05% | ≤ 0.05% | | **Aluminum (Al)**| ≤ 0.05% | ≤ 0.05% | | **Sulfur (S)** | ≤ 0.015% | ≤ 0.015% | | **Phosphorus (P)**| ≤ 0.015% | ≤ 0.015% | --- ### **3. PHYSICAL & MECHANICAL PROPERTIES** | Property | Typical Value (Annealed) | |---------------------------------|--------------------------| | **CTE (20–300°C)** | 4.5 – 5.5 × 10⁻⁶/°C | | **Density** | 8.11 g/cm³ | | **Melting Point** | 1420 – 1450°C | | **Tensile Strength** | 510 – 610 MPa | | **Yield Strength (0.2% Offset)**| 270 – 370 MPa | | **Elongation (in 2")** | 30 – 40% | | **Modulus of Elasticity** | 145 GPa | | **Hardness (Rockwell B)** | 65 – 80 HRB | | **Electrical Resistivity** | 0.75 μΩ·m | | **Thermal Conductivity** | 14.5 W/m·K | | **Curie Temperature** | 360°C | --- ### **4. INTERNATIONAL STANDARDS & EQUIVALENTS** | Standard Organization | Designation & Specification | |-----------------------|----------------------------| | **UNS** | K94100 | | **ASTM** | F30 (Alloy 42) | | **EN (European)** | 1.3917 (Ni42Fe) | | **ISO** | NiFe42 | | **JIS (Japan)** | C42N | | **GB (China)** | 4J42 | | **DIN (Germany)** | Ni42 | | **Sheet Standards** | ASTM A480, AMS 7721 | --- ### **5. SHEET SPECIFICATIONS** #### **5.1 Standard Sheet** - **Thickness Range**: 0.5 mm to 3.0 mm - **Width Range**: 600 mm to 1200 mm - **Length Range**: 1200 mm to 2400 mm - **Thickness Tolerance**: ±0.05 mm to ±0.15 mm - **Flatness**: 3 mm per meter maximum #### **5.2 Precision Cold-Rolled Sheet** - **Thickness Range**: 0.1 mm to 2.0 mm - **Width Range**: 300 mm to 600 mm - **Length**: Coils or cut lengths - **Thickness Tolerance**: ±0.02 mm to ±0.08 mm - **Surface Finish**: Bright annealed or skin-passed #### **5.3 Temper Conditions** - **Annealed (Soft)**: Optimal for deep drawing and forming - **Quarter-Hard**: Good formability with moderate strength - **Half-Hard**: Balanced formability and spring properties - **Hard**: Maximum strength for structural applications --- ### **6. PRODUCT APPLICATIONS** #### **6.1 Electronics & Semiconductor** - **Lead Frames**: Integrated circuits and transistor lead frames - **Semiconductor Packaging**: Chip carrier and package substrates - **Electronic Connectors**: Precision connector components - **Hybrid Circuits**: Thick-film circuit bases #### **6.2 Glass & Ceramic Sealing** - **Hermetic Seal Components**: Glass-to-metal seal parts - **Ceramic Package Lids**: Semiconductor package covers - **Optical Window Frames**: Laser and optical package frames - **Feedthrough Plates**: Electrical feedthrough mounting plates #### **6.3 Automotive Electronics** - **Sensor Components**: Automotive sensor mounting elements - **ECU Housing Parts**: Electronic control unit components - **Ignition System Parts**: Ignition module components - **Power Module Bases**: Power electronics substrates #### **6.4 Consumer Electronics** - **LED Packaging**: Light emitting diode package components - **Display Mounting**: Flat panel display structural elements - **Battery Contacts**: Power supply contact components - **Communication Devices**: Mobile device shielding elements --- ### **7. FABRICATION CHARACTERISTICS** #### **7.1 Stamping & Blanking** - **Fine Blanking**: Suitable for precision blanking operations - **Tool Clearance**: 5-8% of material thickness - **Punch-Die Alignment**: Critical for burr-free edges - **Lubrication**: Recommended for high-volume production #### **7.2 Forming & Deep Drawing** - **Deep Drawing**: Excellent in annealed condition - **Bend Radius**: Minimum 0.5× thickness for 90° bends - **Springback**: Predictable and consistent - **Work Hardening**: Moderate, may require intermediate annealing #### **7.3 Heat Treatment** - **Annealing**: 750-850°C in protective atmosphere - **Stress Relieving**: 400-500°C for formed components - **Atmosphere Control**: Hydrogen or vacuum recommended - **Grain Size**: Controlled to ASTM 7-9 for optimal formability --- ### **8. QUALITY ASSURANCE** #### **8.1 Dimensional Control** - **Thickness Verification**: Laser gauge monitoring during rolling - **Width Control**: Precision slitting with edge monitoring - **Flatness Measurement**: Automated flatness measurement systems - **Surface Inspection**: 100% visual inspection for critical grades #### **8.2 Material Testing** - **Chemical Analysis**: Spectrometer verification for each heat - **Mechanical Testing**: Regular tensile and hardness testing - **Surface Quality**: Controlled per ASTM A480 requirements - **Grain Size Measurement**: ASTM E112 compliance #### **8.3 Certification & Traceability** - **Material Certificates**: EN 10204 3.1/3.2 certification - **Heat Number Tracking**: Full material history maintained - **Process Control**: Statistical process monitoring records - **Custom Documentation**: Customer-specific requirements --- ### **9. TECHNICAL ADVANTAGES** - **Perfect CTE Match**: Excellent thermal compatibility with glass and ceramics - **Superior Formability**: Excellent deep drawing and stamping characteristics - **Excellent Surface Quality**: Ideal for precision electronic applications - **Good Weldability**: Compatible with resistance and laser welding - **Thermal Stability**: Maintains properties across temperature ranges - **Consistent Quality**: Reliable performance in volume production --- ### **10. PACKAGING & DELIVERY** #### **10.1 Standard Packaging** - **Individual Sheets**: Separated with protective interleaving - **Coil Packaging**: Wooden or steel reels with edge protection - **Surface Protection**: VCI paper or plastic film wrapping - **Moisture Control**: Desiccant in sealed packages #### **10.2 Special Requirements** - **Cleanroom Packaging**: Class 1000 environment available - **ESD Protection**: Anti-static packaging materials - **Custom Sizes**: Precision slit to specific widths - **Just-in-Time**: Scheduled delivery programs --- **Note:** For critical stamping or deep drawing applications, sample material is recommended for tooling development and process optimization. Technical consultation is available for specific application requirements and processing guidance.

Packing of Standard Packing: Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 2462 gallon liquid totes Special package is available on request.