Nickel 205,Nickel, Ni, UNS N02205; 1

### Technical Datasheet: Nickel 205 (UNS N02205) **Classification:** High Purity Nickel with Controlled Magnesium Addition **Alternative Names:** Low Cobalt Nickel, Electronic Grade Nickel **Specifications:** UNS N02205; ASTM F1, F2, F3, F9; SAE AMS 5555; MIL-N-46025; Werkstoff Nr. 2.4061 --- #### 1.0 Introduction **Nickel 205** is a high-purity, low-cobalt nickel alloy specifically developed for electronic and electrical applications requiring controlled magnetic and thermal expansion properties. This commercially pure nickel variant contains a small but critical magnesium addition (0.01-0.10%) that enhances its high-temperature stability and creep resistance while maintaining excellent electrical and thermal conductivity. The alloy's **precisely controlled composition and consistent properties** make it particularly valuable for vacuum tube components, electronic structural parts, and applications requiring specific magnetic characteristics. --- #### 2.0 Chemical Composition (Weight %) | Element | Minimum | Maximum | Typical Value | Function | |---------|---------|---------|---------------|----------| | **Nickel (Ni)** | 99.0 | Balance | 99.5 | Base element | | **Magnesium (Mg)** | 0.01 | 0.10 | 0.05 | High-temperature strength, grain refinement | | **Cobalt (Co)** | - | 0.15 | 0.08 | Controlled impurity | | **Copper (Cu)** | - | 0.25 | 0.15 | - | | **Iron (Fe)** | - | 0.20 | 0.10 | Controlled for magnetic properties | | **Manganese (Mn)** | - | 0.35 | 0.20 | - | | **Carbon (C)** | - | 0.15 | 0.08 | - | | **Silicon (Si)** | - | 0.15 | 0.08 | - | | **Sulfur (S)** | - | 0.008 | 0.005 | - | | **Other Elements** | - | 0.50 | 0.20 | - | *Key Feature: Controlled low cobalt content for specific electronic applications* --- #### 3.0 Physical Properties | Property | Value | Condition/Notes | |----------|-------|-----------------| | **Density** | 8.89 g/cm³ (0.321 lb/in³) | At room temperature | | **Melting Point** | 1435-1445°C (2615-2633°F) | - | | **Thermal Expansion Coefficient** | 13.3 μm/m·°C | 20-100°C | | **Thermal Conductivity** | 82 W/m·K | At 100°C | | **Electrical Resistivity** | 0.86 μΩ·m | At 20°C | | **Modulus of Elasticity** | 204 GPa (29.6×10⁶ psi) | At room temperature | | **Curie Temperature** | 353°C (667°F) | Magnetic transition point | | **Magnetic Permeability** | 110-200 (initial) | At 200 Oe | --- #### 4.0 Mechanical Properties **4.1 Typical Room Temperature Properties (Annealed Condition):** - **Tensile Strength**: 380-550 MPa (55-80 ksi) - **Yield Strength (0.2% Offset)**: 100-250 MPa (15-36 ksi) - **Elongation**: 40-55% - **Hardness**: 65-85 HRB - **Shear Modulus**: 76 GPa (11.0×10⁶ psi) **4.2 Elevated Temperature Properties:** | Temperature | Tensile Strength | Yield Strength (0.2% Offset) | |-------------|------------------|-----------------------------| | 315°C (600°F) | 330 MPa (48 ksi) | 83 MPa (12 ksi) | | 425°C (800°F) | 290 MPa (42 ksi) | 69 MPa (10 ksi) | | 540°C (1000°F) | 230 MPa (33 ksi) | 62 MPa (9 ksi) | --- #### 5.0 Special Characteristics **5.1 Electronic Properties:** - Consistent magnetic properties - Low magnetic hysteresis - Excellent glass-to-metal sealing characteristics - Good thermionic emission properties - Stable electrical resistance **5.2 Fabrication Advantages:** - Excellent deep drawing capabilities - Good weldability and brazeability - Maintains properties in vacuum environments - Suitable for precision stamping - Good surface finish characteristics --- #### 6.0 Applications **6.1 Electronic Components:** - Electron tube components (anodes, grids, cathodes) - Transmitter tube parts - Klystron and magnetron components - Lead frames and connectors - Semiconductor processing equipment **6.2 Electrical Applications:** - Electrical resistance wires - Magnetic shielding - Waveguide components - Battery components - Electrical contacts **6.3 Special Applications:** - Glass-to-metal seals - Vacuum system components - Aerospace electronic housings - Cryogenic equipment - Precision instruments --- #### 7.0 Fabrication & Processing **7.1 Heat Treatment:** - **Annealing Temperature**: 650-815°C (1200-1500°F) - **Stress Relieving**: 425-650°C (800-1200°F) - **Atmosphere**: Hydrogen or vacuum recommended - **Cooling**: Controlled cooling to prevent oxidation **7.2 Welding & Joining:** - Excellent weldability by all standard methods - Gas tungsten arc welding (GTAW) preferred - Resistance welding suitable for thin sections - Brazing with silver-based or nickel-based filler metals **7.3 Forming Operations:** - Excellent deep drawing characteristics - Good stamping and blanking performance - Suitable for severe forming operations - Intermediate annealing may be required --- #### 8.0 International Standards & Specifications **Primary Specifications:** | Standard Organization | Standard Number | Description | |----------------------|-----------------|-------------| | **ASTM International** | ASTM F1 | Electronic Grade Nickel Strip | | **ASTM International** | ASTM F2 | - | | **ASTM International** | ASTM F3 | - | | **ASTM International** | ASTM F9 | - | | **SAE International** | AMS 5555 | Nickel Alloy, Corrosion and Heat-Resistant | | **U.S. Military** | MIL-N-46025 | Nickel, Wrought, Low Cobalt | | **German Standard** | Werkstoff Nr. 2.4061 | Nickel with Magnesium Addition | | **Unified Numbering System** | UNS N02205 | Material Designation | **Additional International Standards:** - **ISO 6208**: Nickel and nickel alloys - Sheet, plate and strip - **EN 10095**: Heat resisting steels and nickel alloys - **JIS H 4551**: Nickel and nickel alloy sheets, plates and strips --- #### 9.0 Quality Assurance & Testing **Standard Testing Requirements:** - Chemical analysis verification - Mechanical property testing - Magnetic property testing - Surface quality inspection - Dimensional verification - Electrical conductivity testing - Non-destructive testing (as required) **Special Testing (Electronic Applications):** - Thermal expansion coefficient measurement - Glass-to-metal seal compatibility - Vacuum outgassing characteristics - Magnetic permeability verification --- **Note:** Nickel 205 is specifically engineered for electronic applications where consistent magnetic properties and reliable performance in vacuum environments are critical. The controlled magnesium addition provides improved high-temperature strength and grain stability compared to pure nickel, while maintaining the essential electrical and magnetic characteristics required for electronic components. This alloy is particularly valuable in applications where precise property control and lot-to-lot consistency are essential for manufacturing reliability.

Packing of Standard Packing: Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 3287 gallon liquid totes Special package is available on request.